The Union Cabinet chaired by the Prime Minister today gave its formal approval to the expanded Semiconductor and High-Tech Hardware Manufacturing Mission, earmarking an aggregate fiscal incentive outlay of ₹76,000 Crore.
Addressing a joint press briefing at the National Media Centre in New Delhi, Union Ministers outlined that the initiative will catalyse over 100,000 high-skilled engineering jobs while establishing advanced semiconductor fabrication, assembly, testing, and packaging (ATMP) units across major technological corridors in Gujarat, Maharashtra, and Karnataka.
"India is positioning itself as a trusted global partner in the resilient electronics and chip manufacturing value chain," said the official release.
Global semiconductor giants and domestic conglomerates have already submitted multi-billion dollar proposals to set up ultra-pure silicon processing facilities, with construction scheduled to commence within the next quarter.